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INTEGRATED CIRCUITS
DATA SHEET
TJA1053 Fault-tolerant CAN transceiver
Product specification Supersedes data of 1997 Oct 15 File under Integrated Circuits, IC18 2000 Dec 18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
FEATURES Optimized for in-car low-speed communication * Baud rate up to 125 kbaud * Up to 32 nodes can be connected * Supports unshielded bus wires * Low RFI due to built-in slope control function * Fully integrated receiver filters * Permanent dominant monitoring of TXD. Bus failure management * Supports one-wire transmission modes with ground offset voltages up to 1.5 V * Automatic switching to single-wire mode in the event of bus failure * Automatic reset to differential mode if bus failure is removed. Protection * Short-circuit proof to battery and ground in 12 V powered systems * Thermally protected * Bus lines protected against transients in an automotive environment QUICK REFERENCE DATA SYMBOL VCC VBAT PARAMETER supply voltage battery voltage no time limit operating load dump IBAT(sleep) sleep mode current VCC = 0 V; VBAT = 12 V VCC = 0 to 5.5 V; VBAT 0 V; no time limit VCC = 0 to 5.5 V; VBAT 0 V; t < 0.1 ms; load dump VDROP(H) VDROP(L) tPD tf tr Tamb CANH transmitter drop voltage ICANH = 40 mA CANL transmitter drop voltage ICANL = 40 mA propagation delay bus output fall time bus output rise time operating ambient temperature TXD to RXD 90% to 10% 10% to 90% VCANH,VCANL CANH, CANL input voltage CONDITIONS MIN. 4.75 -0.3 6.0 - - -10 -40 - - - - - -40 - - - - 65 - - - - 1 0.5 0.5 - TYP. GENERAL DESCRIPTION
TJA1053
* An unpowered node does not disturb the bus lines. Support for low-power modes * Low current sleep/standby mode with wake-up via the bus lines * Power-on reset flag on the output.
The TJA1053 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for low-speed applications, up to 125 kbaud, in passenger cars. The device provides differential transmit capability but will switch in error conditions to a single-wire transmitter and/or receiver. The TJA1053 is derived from the PCA82C252 giving the following advantages: * Better equipped for networks with more than 15 nodes * Integrated timer at the TXD input prevents a permanent dominant state * Reduced supply current in VCC standby mode * CANH output driver is disabled in the event of a `CANH short-circuited to battery' failure mode.
MIN. 5.25 +27 27 40 - +27 +40 1.4 1.4 - - - +125
UNIT V V V V A V V V V s s s C
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
ORDERING INFORMATION TYPE NUMBER TJA1053T BLOCK DIAGRAM PACKAGE NAME SO14 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm
TJA1053
VERSION SOT108-1
handbook, full pagewidth
BAT 14
VCC 10 12.5 k
INH WAKE STB EN
1 7 5 6 VCC 2 DRIVER TIMER WAKE-UP STANDBY CONTROL TEMPERATURE PROTECTION
9 11 12 8
RTL CANH CANL RTH
TXD
TJA1053
4 FAILURE DETECTOR PLUS WAKE UP PLUS TIME-OUT
NERR
FILTER 3 RECEIVER FILTER 13 GND
RXD
MGL181
Fig.1 Block diagram.
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
PINNING SYMBOL INH TXD PIN 1 2 DESCRIPTION inhibit output for switching external 5 V regulator transmit data input, when LOW bus data will be dominant, when HIGH bus data will be recessive receive data output, when LOW bus data will be dominant error output pin, when LOW a bus error exists not standby digital control input signal (active LOW) enable digital control input signal not wake input signal, when pulled down INH becomes active for wake-up (active LOW) termination resistor, CANH line will be high-impedance with certain bus errors termination resistor, CANL line will be high-impedance with certain bus errors supply voltage (+5 V) high voltage bus line, will be HIGH in dominant state low voltage bus line, will be LOW in dominant state ground battery voltage Fig.2 Pin configuration.
TJA1053
RXD NERR STB EN WAKE
3 4 5 6 7
handbook, halfpage
INH TXD RXD NERR STB EN WAKE
1 2 3 4 5 6 7
MGL182
14 BAT 13 GND 12 CANL
TJA1053T 11 CANH
10 VCC 9 8 RTL RTH
RTH
8
RTL
9
VCC CANH CANL GND BAT
10 11 12 13 14
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1053 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for low speed applications, up to 125 kbaud, in passenger cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. To reduce RF interference the rise and fall slope are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus. Moreover, it supports transmission capability on either bus wire if one of the bus wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operation (no wiring failures) the differential receiver is output to RXD. The differential receiver inputs are connected to CANH and CANL through integrated filters. The filtered input signals are also used for the single wire receivers. The CANH and CANL receivers have threshold voltages that ensure a maximum noise margin in single-wire modes. A timer has been integrated at the TXD input. This timer prevents the TJA1053 driving the bus lines to permanent dominant state. Failure detector The failure detector is active in the normal operation mode and detects the following single bus failures and switches to an appropriate mode: 1. CANH wire interrupted 2. CANL wire interrupted 3. CANH short-circuited to battery 4. CANL short-circuited to ground 5. CANH short-circuited to ground 6. CANL short-circuited to battery 7. CANL mutually shorted to CANH. The differential receiver threshold is set at -2.9 V. This ensures correct reception in the normal operating modes and, in the event of failures 1, 2 and 5 with a noise margin as high as possible. These failures, or recovery from them, do not destroy ongoing transmissions. Failures 3 and 6 are detected by comparators connected to CANH and CANL, respectively. If the comparator threshold is exceeded for a certain period of time, the reception is switched to the single-wire mode.
TJA1053
This time is needed to avoid false triggering by external RF fields. Recovery from these failures is detected automatically after a certain time-out (filtering) and no transmission is lost. The CANH driver and the RTH pin are switched off in the event of failure 3. Failures 4 and 7 initially result in a permanent dominant level at RXD. After a time-out, the CANL driver and the RTL pin are switched off. Only a weak pull-up at RTL remains. Reception continues by switching to the single-wire mode via CANH. When failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. If any of the seven wiring failures occur, the output NERR will be made LOW. On error recovery, NERR will be made HIGH again. During all single-wire transmissions, the EMC performance (both immunity and emission) is worse than in the differential mode. Integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In the single-wire mode, low frequency noise cannot be distinguished from the required signal. Low power modes The transceiver provides 3 low power modes which can be entered and exited via pins STB and EN (see Table 1). The sleep mode is the mode with the lowest power consumption. The INH pin is switched to high-impedance for deactivation of external voltage regulators. CANL is biased to the battery voltage via the RTL output. If the supply voltage is provided the RXD and NERR will signal the wake-up interrupt The VBAT standby mode will react the same as the sleep mode with an active INH output. The VCC standby mode is the VBAT standby with RTL switched to the VCC voltage. In this mode the NERR output signals the VBAT power-on flag and the RXD output will show the wake-up interrupt.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
Wake-up requests are recognized by the transceiver when a dominant signal is detected on either bus line or if the WAKE pin is connected to ground. On a wake-up request the transceiver will set the INH output which can be used to activate the external VCC voltage regulator. If VCC is provided the wake-up request can be read on the NERR or RXD outputs, on which the external microcontroller can wake up the transceiver (switch to normal operating mode) via STB and EN. To prevent false wake-up due to transients or RF fields, wake-up voltage threshold levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent increased power consumption should errors 3, 4 and 7 occur. Power on After power-on VBAT is switched on, the INH pin will become HIGH and an internal power-on flag will be set. This flag can be read via the NERR pin (STB = 1, EN = 0) and will be reset by entering the normal operation mode. Table 1 Truth table of CAN transceiver MODE VBAT standby(1) sleep(2) go to sleep command VCC standby(3) normal operation mode INH HIGH floating floating HIGH HIGH active LOW VBAT power-on flag active LOW error flag active LOW wake-up interrupt HIGH = receive; LOW = dominant received data NERR RXD
TJA1053
The EN and STB pins will internally be set to LOW level, if the VCC voltage is below a certain threshold level, to provide fail safe functionality. Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain operating. The CANH and CANL inputs are protected against electrical transients which may occur in an automotive environment.
STB EN 0 0 0 1 1 0 0 1 0 1
RTL switched to VBAT switched to VBAT switched to VCC switched to VCC
active LOW wake-up interrupt signal if VCC is present switched to VBAT
Notes 1. Wake-up interrupts are released when entering normal operating mode. 2. If go to sleep command was used before (EN may turn LOW as VCC drops, without affecting internal functions because of fail safe functionality). 3. VBAT power-on flag will be reset when entering normal operation mode.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC VDD VBUS VCANH, VCANL Vtr VWAKE IWAKE V1,8,9 VBAT R8,9 Tvj Tstg Vesd supply voltage DC input voltage at pins 2 to 6 DC input voltage at pins 11 and 12 DC input voltage at pins 11 and 12 PARAMETER CONDITIONS MIN. -0.3 -0.3 -10 VCC = 0 to 5.5 V; -40 VBAT 0 V; t < 0.1 ms; load dump see Fig.6 -150 - -15 -0.3 -0.3 load dump; 500 ms note 1 note 2 note 3 Notes - 500 -40 -55 -2000 -200
TJA1053
MAX. +6.0 VCC + 0.3 +27 +40 V V V V
UNIT
transient voltage at pins 11 and 12 DC input voltage on pin 7 input current pin 7 DC input voltage on pins 1, 8 and 9 DC input voltage on pin 14 voltage on pin 14 termination resistances pins 8 and 9 virtual junction temperature storage temperature electrostatic discharge voltage at any pin
+100 - +27 40 16000 +150 +150 +2000 +200
V mA V V C C V V
VBAT + 0.3 V VBAT + 0.3 V
1. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj = Tamb + PD x Rth vj-a. Where: Rth vj-a is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation and ambient temperature. 2. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 3. Machine model: equivalent to discharging a 200 pF capacitor through a 25 resistor. THERMAL CHARACTERISTICS SYMBOL Rth vj-a PARAMETER CONDITIONS VALUE 120 UNIT K/W
thermal resistance from junction to ambient in free air
QUALITY SPECIFICATION Quality specification in accordance with "SNW-FQ-611-Part-E".
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
CHARACTERISTICS VCC = 4.75 to 5.25 V; VSTB = VCC; VBAT = 6 to 27 V; Tamb = -40 to +125 C; all voltages are defined with respect to ground; positive currents flow into the IC; all parameters are guaranteed over the temperature range by design, but only 100% tested at 25 C; unless otherwise specified. SYMBOL Supplies ICC supply current recessive; TXD = VCC; normal operating mode dominant; TXD = 0 V; no load; normal operating mode ICC + IBAT IBAT + ICC IBAT(sleep) VBAT tpwon supply current supply current supply current battery voltage for setting power-on flag battery voltage low time for setting power-on flag VCC standby; VCC = 5 V; VBAT = 12 V; Tamb < 90 C VBAT standby; VCC = 5 V; VBAT = 12 V; Tamb < 90 C sleep mode; VCC = 0 V; VBAT = 12 V; Tamb < 90 C low power modes low power modes - - - - - - 1 6 29 200 70 65 - - 10 35 500 95 90 1.0 - mA mA A A A V s PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pins STB, EN and TXD VIH VIL IIH IIL IIH IIL VCC HIGH-level input voltage LOW-level input voltage HIGH-level input current (pins STB and EN) LOW-level input current (pins STB and EN) HIGH-level input current (pin TXD) LOW-level input current (pin TXD) forced VBAT standby mode (fail safe) Io = -100 A Io = -250 A Io = 1.25 mA VWAKE = 0 V; VBAT = 27 V VSTB = 0 V Vi = 4 V Vi = 1 V Vi = 4 V Vi = 1 V 0.7VCC -0.3 - 4 -25 -100 2.75 - - 9 8 -80 -320 - VCC + 0.3 0.3VCC 20 - -200 -800 4.5 V V A A A A V
Pins RXD and NERR VOH VOH VOL Pin WAKE IIL Vwu(th) LOW-level input current wake-up threshold voltage -70 1.7 -40 3.0 -10 4.0 A V HIGH-level output voltage (pin NERR) HIGH-level output voltage (pin RXD) LOW-level output voltage VCC - 0.9 VCC - 0.9 0 - - - VCC VCC 0.9 V V V
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
SYMBOL Pin INH VdropH ILI Vdrx VoCANHrec VoCANLrec
PARAMETER
CONDITIONS IINH = -0.18 mA; VBAT < 16 V - IINH = -0.18 mA; VBAT > 16 V - sleep mode; VINH = 0 V no bus failures bus failures 1, 2 and 5 TXD = VCC; RRTH < 4 k TXD = VCC; RRTL < 4 k TXD = 0 V; V6 = VCC; ICANH = -40 mA TXD = 0 V; V6 = VCC; ICANL = 40 mA VCANH = 0 V; TXD = 0 V sleep mode; VCANH = 12 V VCANL = 14 V; TXD = 0 V sleep mode; VCANL = 0 V; VBAT = 12 V
MIN.
TYP. - - - - - - - - -75 0 90 0 7.3
MAX.
UNIT
HIGH-level voltage drop leakage current
0.8 1.0 +5.0 -2.65 0.2 - - 1.4 -100 - 130 - 8.0
V V A V V V V V mA A mA A V
-5.0 -3.25 - VCC - 0.2 VCC - 1.4 - - - - - 6.5
Pins CANH and CANL differential receiver threshold voltage CANH recessive output voltage CANL recessive output voltage
VoCANHdom CANH dominant output voltage VoCANLdom IoCANH IoCANL CANL dominant output voltage CANH output current CANL output current
Vdet(th)H,L
voltage detection threshold for normal mode short-circuit to battery voltage on CANH and CANL voltage detection threshold for standby/sleep mode short-circuit to battery voltage on CANH CANL wake-up voltage threshold CANH wake-up voltage threshold wake-up voltage threshold difference CANH single-ended receiver threshold CANL single-ended receiver threshold voltage failures 4, 6 and 7 failure 3
Vdet(th)H
VBAT - 2.5 -
VBAT - 1
V
VwuL VwuH VwuL-VwuH VCANH VCANL
2.4 1.2 0.2 1.5 2.8
3.1 1.9 - 1.82 3.1
3.8 2.7 - 2.15 3.4
V V V V V
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
SYMBOL Pins RTH and RTL RRTL
PARAMETER
CONDITIONS - - 8 - - - -
MIN.
TYP.
MAX.
UNIT k V A A
RTL to VCC switch-on resistance Io < 10 mA; normal operating mode Io < 1 mA; VCC standby mode RTL to VBAT switch series resistance VBAT standby or sleep mode Io < 10 mA; normal operating mode Io = 1 mA; low power modes normal operating mode, failures 4, 6 and 7 normal operating mode, failure 3
7 15 12.5 43 0.7 75 75
25 75 23 95 1.0 - -
RRTH VoRTH IRTLpu IRTHpd
RTH to ground switch-on resistance RTH output voltage RTL pull-up current RTH pull-down current
Thermal shutdown Tjsd shutdown junction temperature 155 165 180 C
AC CHARACTERISTICS VCC = 4.75 to 5.25 V; VSTB = VCC; VBAT = 6 to 27 V; Tamb = -40 to +125 C; all voltages are defined with respect to ground; positive currents flow into the IC; all parameters are guaranteed over the temperature range by design, but only 100% tested at 25 C; unless otherwise specified. SYMBOL tt(r-d) PARAMETER CANL and CANH bus output transition time recessive-to-dominant CANL and CANH bus output transition time dominant-to-recessive propagation delay TXD-to-RXD LOW CONDITIONS 10% to 90%; C1 = 10 nF; C2 = 0; R1 = 100 10% to 90%; C1 = 1 nF; C2 = 0; R1 = 100 C1 = 100 pF; C2 = 0; R1 = 100 ; no failures and bus failures 1, 2 and 5 C1 = C2 = 3.3 nF; R1 = 100 ; no failures and bus failures 1, 2 and 5 C1 = 100 pF; C2 = 0; R1 = 100 ; bus failures 3, 4, 6 and 7 C1 = C2 = 3.3 nF; R1 = 100 ; bus failures 3, 4, 6 and 7 MIN. 0.6 TYP. 0.85 - MAX. UNIT s
tt(d-r)
0.3
0.4
-
s
tPD(L)
-
0.75
1.25
s
-
1
1.5
s
-
0.85
1.3
s
-
1.1
1.7
s
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
SYMBOL tPD(H)
PARAMETER propagation delay TXD-to-RXD HIGH
CONDITIONS C1 = 100 pF; C2 = 0; R1 = 100 ; no failures and bus failures 1, 2 and 5 C1 = C2 = 3.3 nF; Rl = 100 ; no failures and bus failures 1 and 2 C1 = 100 pF; C2 = 0; R1 = 100 ; bus failures 3, 4, 6 and 7 C1 = C2 = 3.3 nF; R1 = 100 ; bus failures 3, 4, 5, 6 and 7 -
MIN.
TYP. 0.95
MAX. 1.5
UNIT s
-
2.2
3.0
s
-
0.85
1.3
s
-
1.4
2.1
s
twu(min) t WAKE(min) tfail
minimum dominant time for wake-up on CANL or CANH minimum WAKE LOW time for wake-up failure 3 detection time failure 6 detection time failure 3 recovery time failure 6 recovery time failures 4 and 7 detection time failures 4 and 7 recovery time
low power modes VBAT = 12 V low power modes VBAT = 12 V normal mode normal mode normal mode normal mode normal mode normal mode
8 8 10 50 10 150 0.75 10 0.8 - 0.75 5
- - - - - - - - - 4 - -
38 38 60 400 60 750 4.0 60 8.0 - 4.0 50
s s s s s s ms s ms ms ms s
failures 3, 4 and 7 detection time low power modes; VBAT = 12 V failures 3, 4 and 7 recovery time tTXD th(min) ec TXD permanent dominant timer, disable time minimum hold time to go to sleep command edge-count difference between CANH and CANL for failures 1, 2 and 5 detection normal mode (NERR becomes LOW) for failures 1, 2 and 5 recovery normal mode low power modes; VBAT = 12 V normal mode and failure modes
- -
3 1
- -
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TEST AND APPLICATION INFORMATION
TJA1053
ndbook, full pagewidth
+5 V INH WAKE TXD STB EN RXD 1 7 2 5 6 3 13 20 pF
+12 V BAT 14
VCC 10 8 RTH R1(1) C1(2)
12
CANL C2(2)
TJA1053
11 CANH
9 4 NERR GND
RTL R1(1) C1(2)
MGL183
(1) Termination resistors R1 (100 ) are not connected to RTH or RTL for testing purposes because the minimum load resistance allowed on the CAN bus line is 500 per transceiver. (2) The capacitive bus load of 10 nF is split into three equal capacitors (3.3 nF) to simulate the CAN bus line.
Fig.3 Test circuit for dynamic characteristics.
handbook, full pagewidth
VTXD
VCC 0V
VCANL
5V 3.6 V 1.4 V
VCANH
0V
2.2 V
-2.9 V Vdiff(1) VRXD 0.7VCC 0.3VCC tPD(L) tPD(H)
MGL184
-5 V
(1) Vdiff = VCANH - VCANL
Fig.4 Timing diagram for dynamic characteristics.
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
handbook, full pagewidth
VBAT
BATTERY
P8xC592/P8xCE598
CAN CONTROLLER
+5 V +5 V
CTX0
CRXO
TXD WAKE 2 7 3
RXD 5
STB 4
NERR 6
EN 1
INH 14 BAT VCC GND 100 nF
TJA1053
CAN TRANSCEIVER
10 13
8 RTH
11 CANH
12 CANL
9 RTL
CAN BUS LINE
MGL185
Fig.5 Application of the TJA1053.
handbook, full pagewidth
+5 V INH WAKE TXD STB EN RXD 1 7 2 5 6 3 13 20 pF
+12 V BAT 14 VCC 10 8 RTH 100
12
CANL 1 nF GENERATOR
TJA1053
11 CANH
1 nF 9 4 NERR
MGL186
RTL 100
GND
The waveforms of applied transients shall be in accordance with "ISO7637, part 1", test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm
TJA1053
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Dec 18
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TJA1053
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods
TJA1053
SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TJA1053
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Dec 18
17
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
NOTES
TJA1053
2000 Dec 18
18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
NOTES
TJA1053
2000 Dec 18
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
703502/02/pp20
Date of release: 2000
Dec 18
Document order number:
9397 750 07796

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